法国专利FR3020986A1 HYBRID SECURITY DEVICE FOR SECURITY DOCUMENT OR TOKEN

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专利摘要:
The invention relates to a hybrid security device for security documents and the like, in which the microstructure for a first optically variable device (OVD) and the microstructure for a second OVD are mutually interlaced or intertwined. The first microstructure has a height profile which differs from that of the second microstructure by more than 0.5 microns. It also relates to methods of manufacturing the hybrid security device.
公开号:FR3020986A1
申请号:FR1554330
申请日:2015-05-13
公开日:2015-11-20
发明作者:Robert Arthur Lee；Michael Hardwick
申请人:Innovia Secutiry Pty Ltd；
IPC主号:

专利说明:

[0001] TECHNICAL FIELD TO WHICH THE INVENTION RELATES The invention relates to security devices applied to security documents or tokens as anti-counterfeiting measures. The invention also relates to production methods used for the manufacture of these security devices and the application thereof to security documents or tokens. DEFINITIONS Security Document or Token As used herein, the terms "security documents" and "tokens" include all types of documents and tokens of documents of value and identification including, but not limited to, the following documents: : coins such as banknotes and coins, credit cards, checks, passports, identity cards, securities and certificates of shares, driving licenses, deeds of ownership, transportation documents such as airline and train tickets, cards and tickets, birth, death and marriage certificates, and diplomas. The invention applies in particular, but not exclusively, to security documents or tokens such as banknotes or identification documents such as identity cards or passports formed from a substrate on which one or more printing layers are applied. The diffraction gratings and optically variable devices described herein may also have application to other products, such as packaging.
[0002] Device or Security Feature As used herein, the term "security device or feature" includes any of a variety of security devices, features, or features intended to protect the security document or token of security. counterfeiting, copying, alteration or falsification. Devices or security features may be provided in or on the security document substrate or in or on one or more layers applied to the base substrate, and may take a variety of forms, such as security threads embedded in layers of the security document; security inks such as fluorescent, luminescent and phosphorescent inks, metallic inks, iridescent inks, photochromic, thermochromic, hydrochromic or piezochromic inks; printed and embossed features, including relief structures; interference layers; liquid crystal devices; lenses and lenticular structures; optically variable (OVD) devices such as diffractive devices including diffraction gratings, holograms, diffractive optical elements (DOEs) and micro-mirror array devices (see for example US 7,281,810).
[0003] Substrate As used herein, the term "substrate" refers to the base material from which the security document or token is formed. The base material may be paper or other fibrous material, such as cellulose; a plastic or polymeric material including, but not limited to, polypropylene (PP), polyethylene (PE), polycarbonate (PC), polyvinyl chloride (PVC), polyethylene terephthalate (PET), polypropylene bi-axially oriented (BOPP); or a composite material of two or more materials such as a laminate of paper and at least one plastic material, or two or more polymeric materials. Optically variable image (OVD) An optically variable image or device is a security feature or feature that changes appearance. OVDs provide an optical variation effect when the bill is switched and / or when the observer's viewing angle to the OVD changes. The OVD image may also be modified by aligning a verification device over the security feature or device. An OVD may be realized by a printed area, for example a printed area with metallic inks or iridescent inks, an embossed area, and a combination of a printed and embossed feature. An OVD may also be realized by a diffractive device, such as a diffraction grating or a volume hologram and may include microlens and lenticular lens arrays.
[0004] Diffractive Optical Elements (DOE) As used herein, the term "diffractive optical element" refers to a diffractive optical element (DOE) of the digital type. Diffractive optical elements (DOE) of the digital type rely on the mapping of complex data that reconstruct in the far field (or a reconstruction plane) a two-dimensional intensity pattern. Therefore, when a substantially collimated light, e.g. from a point light source or a laser, is incident on the DOE, an interference pattern is generated that produces a projected image in the reconstruction plane. which is visible when an appropriate viewing surface is located in the reconstruction plane, or when the DOE is seen in transmission at the reconstruction plane. The transformation between the two planes can be approximated by a Fast Fourier Transformation (FFT). Therefore, complex data including amplitude and phase information must be physically encoded in the DOE microstructure. These DOE data can be calculated by performing an inverse FFT transformation of the desired reconstruction (i.e., the desired intensity pattern in the far field). DOEs are sometimes called computer-generated holograms, but they differ from other types of holograms, such as rainbow holograms, Fresnel holograms, and volume-reflection holograms. Embossable Radiation Curable Ink The term "embossable radiation curable ink" as used herein refers to any ink, lacquer or other coating that may be applied to the substrate in a printing process, and which may be embossed to the soft state to form a relief structure and hardened to fix embossed embossed structure. The curing process is not carried out until the radiation-curable ink is embossed, but it is possible to put the curing process into effect either after the embossing or essentially at the same time as the embossing step . The radiation curable ink is preferably curable by ultraviolet (UV) radiation. Alternatively, the radiation curable ink may be cured by other forms of radiation, such as electron beams or X-rays.
[0005] The radiation curable ink is preferably a clear or translucent ink formed from a clear resin material. Such transparent or translucent ink is particularly suitable for printing light-transmitting security elements such as subwavelength gratings, transmissive diffraction gratings and lens structures. In a particularly preferred embodiment, the transparent or translucent ink preferably comprises a lacquer or a UV-curable, clear, acryl-based, lacquerable coating.
[0006] Such UV curable lacquers can be obtained from various manufacturers, including Kingfisher Ink Limited, ultraviolet type product UVF203 or the like. Alternatively, the radiation curable embossable coatings may be based on other compounds, for example nitrocellulose.
[0007] The radiation curable inks or lacquers used herein have proved particularly suitable for embossing microstructures, including diffractive structures such as diffraction gratings and holograms, and microlens and lens arrays. However, they can also be embossed with larger relief structures, such as non-diffractive optically variable devices. The ink is preferably embossed and cured by ultraviolet (UV) radiation essentially at the same time. In a particularly preferred embodiment, the radiation curable ink is applied and embossed substantially at the same time in an intaglio printing process. Preferably, to be suitable for intaglio printing, the radiation curable ink has a viscosity substantially in the range of from about 20 centipoise to about 175 centipoise (175 10-3 Pa). and more particularly about 30 (30-3-3 Pa) to about 150 centipoise (150-10-3Pa). The viscosity can be determined by measuring the time required to empty the lacquer of a Zahn Cup No. 2. A sample which empties in 20 seconds has a viscosity of 30 centipoise (30-10-3Pa. sample that empties in 63 seconds has a viscosity of 150 centipoise (150 10-3Pa. $). With some polymeric substrates, it may be necessary to apply an interlayer to the substrate prior to application of the radiation curable ink to improve adhesion of the embossed structure formed by the ink to the substrate. The intermediate layer preferably comprises a primer layer, and more preferably the primer layer comprises a polyethyleneimine. The primary layer may also comprise a crosslinking agent, for example a multifunctional isocyanate. Examples of other primary layers suitable for use in the invention include: hydroxyl-terminated polymers; copolymers based on a hydroxyl terminated polyester; crosslinked or uncrosslinked hydroxyl acrylates; polyurethanes; and anionic or cationic UV curing acrylates. Examples of suitable crosslinking agents include: isocyanates; polyaziridines; zirconium complexes; aluminumacetylacetone; melamines; and carbodiimides.
[0008] Open security devices Open security devices are those that occur to a person handling the banknote and that include devices such as security threads embedded in layers of the security document and visible at least in transmission when a person keeps the security document in the light; printed features that are visible in reflection and / or transmission; embossed features, including relief structures, which can be tactile so that they can be detected by a person palpating the tactile area of the bill; and optically variable devices (OVDs). OVDs provide an optical variation effect when the bill is switched and / or when the observer's viewing angle to the OVD changes. An OVD may be realized by a printed area, for example a printed area with metallic inks or iridescent inks, an embossed area, and a combination of a printed and embossed feature. An OVD can also be realized by a diffractive device, such as a diffraction grating or a hologram. Covered security devices A covered security device is a device that does not appear to a person handling the banknote without the use of external means of verification or authentication. Covered security devices include features such as micro-printing, which require an enlargement lens for authentication of the micro-print; and characteristics formed by photoluminescent inks and phosphorescent inks which require illumination by electromagnetic radiation of a particular wavelength, for example infrared (IR) or ultraviolet (UV) radiation, for the ink to exhibit luminescence or phosphorescence; and photochromic, thermochromic, hydrochromic or piezochromic inks.
[0009] BACKGROUND TECHNOLOGY A variety of security features are applied to security documents and tokens to deter counterfeiters. For example, bills can have embossed embossed structure in a radiation curable ink layer. It is also known to make security devices with diffractive optical elements (DOE) by embossing the radiation-curable ink with a metal plate. The metal plate has a raised surface structure which is the negative of the desired diffractive structure at the microscopic or nanoscopic scale. The embossed radiation curable ink is then exposed to radiation so as to cure and fix the diffractive structure permanently. The metal plate is typically formed from an "original matrix" as is well known. The diffractive microstructure of the original matrix is formed on a platinum surface. The diffractive microstructure is usually a layer of photoresist that has been masked, exposed to radiation of a particular wavelength and subsequently etched or "developed". The photolithography etching process starts with a suitable photosensitive polymer (known as photoresist) "rotatably deposited" on a substrate board. The platen is literally rotated so that the photoresist layer deposited on the surface has a uniform thickness. Next, an opaque mask is normally applied to the photoresist layer (maskless lithographic techniques are also described hereinafter). The mask has openings in the regions in which the photoresist must be removed. The photoresist is exposed to radiation (usually UV light) through the mask, so that the exposed areas are chemically modified. The mask is removed and a chemical etching agent is used to remove the exposed photoresist so that the unexposed portions remain. This type of photoresist is called "positive" photoresist and is the most common type of photoresist used in photolithography. Exposing large areas of photoresist simultaneously to UV light and subsequent development with an etching agent produces a high efficiency process for accurate microstructure fabrication. Although there may be some variation in the height of the microstructures, it is preferable to keep the height and height profile of all the features relatively uniform. The term "height" refers to the maximum height of the microstructures above the underlying substrate. The term "height profile" refers to the difference in height between the uppermost portion and the lowest part of the microstructure characteristics. Of course, the references to the terms "up", "down", "upper" and "lower" are used in the context of the accompanying figures rather than to imply any particular restriction on the orientation of the security device.
[0010] If the height profile difference between different features of the microstructure is large, the required etch depth becomes large and the etching process loses its accuracy. Those skilled in the art will understand that deep etching suffers from what is called "proximity effect" where the dispersion of the radiation increases all the more as it advances in the photoresist layer. This results in chemical crosslinking in areas that are not expected to be removed by the etching agent, which reduces the resolution or accuracy of the microstructures formed. It will be understood that diffractive devices must be precisely formed in order to generate the required optical effect. To maintain accuracy, deep engraving can be performed in a series of shallow etching steps. Of course, this technique greatly increases the duration and complexity of the process. At each etching step, it is necessary to reapply and align a mask and then engrave the exposed areas. In the light of the above problems, all safety devices with microstructures that have significant differences in height or height profile (for example, a diffraction grating and a much larger hologram structure) are formed separately on the original matrix, and therefore spaced from each other by a minimum distance of about 10 mm. A security device having a diffraction grating immediately adjacent to a hologram or possibly completely surrounding a hologram (or vice versa) will provide a highly distinctive visual impression, and will also be exceptionally difficult to replicate by counterfeiters.
[0011] OBJECT OF THE INVENTION In view of the foregoing, a first aspect of the present invention provides a hybrid security device for security documents and tokens, the hybrid security device comprising: a substrate; a first microstructure for a first optically variable device (OVD) supported on the substrate in a first region; and a second microstructure for a second OVD supported on the substrate in a second region; the first and second regions being mutually interlaced or intersecting in at least one area; and the first microstructure having a height profile which differs from that of the second microstructure by more than 0.5 microns. Preferably, the first microstructures have a maximum height above the surface of the substrate which differs from a maximum height of the second microstructures by more than 0.5 microns. Preferably, the first and second regions are separated by less than 5 mm. Preferably, the first and second regions in the interleaving or intercrossing area are in the form of intersecting pixels of the first microstructure and the second microstructure, and each of the pixels has a maximum dimension of 1 mm in all directions. . Preferably, the first and second regions in the interleaving or intercrossing zone are in the form of interlaced strips of the first microstructure and the second microstructure, each of the strips having a maximum width of 1 mm. In one embodiment, the first OV microstructure is a diffraction grating or a hologram and the second OV microstructure is a diffractive optical element (DOE). In another embodiment, the first OV microstructure is a micro-mirror array and the second microstructure is a DOE. In still another embodiment, the first microstructure OV is a micro-mirror array and the second microstructure is a diffraction grating or hologram. Preferably, the first and second OVDs are formed from an embossable, radiation curable epoxy ink. Preferably, the mutual interlacing zone consists of an area of the first microstructure only.
[0012] A second aspect of the present invention provides a method for producing a hybrid security device for a security document or token, the method comprising the steps of: spin-depositing a negative photoresist layer on a sub-surface -continuous; exposing the negative photoresist layer to an electron beam to write a first stage of a first microstructure pattern and a second microstructure pattern; developing the negative photoresist layer to remove the unexposed areas of the negative photoresist such that there remains a first at least partial microstructure and a second partial microstructure; spin depositing a next negative photoresist layer on the platen to cover the at least partial first microstructure and the second partial microstructure; exposing the next photoresist layer to an electron beam to continue writing the first microstructure pattern if it has not been completed in a previous exposure, and continue to write the second microstructure pattern; developing the next photoresist layer so that it remains the first microstructure and the second partial microstructure; spin depositing a final negative photoresist layer on the platen to cover the first microstructure and the second partial microstructure; exposing the final negative photoresist layer to an electron beam to complete the writing of the second microstructure pattern; developing the final negative photoresist layer such that there remains the first microstructure and the second microstructure on the platen; using the platen and the first and second microstructures to form a raised surface pattern with an inverse of the first and second microstructures; and using the embossed surface pattern to emboss the first and second microstructures in an embossable layer to form the hybrid security device. Preferably, the relief surface pattern is formed on a metal plate.
[0013] Preferably, the metal plate is formed by electrolytic deposition of the first and second microstructures on the platen. Preferably, the second microstructures are at least 0.5 μm more than the first microstructures. Preferably, the first microstructure has a height profile which differs from that of the second microstructure by more than 0.5 microns. Preferably, at least one of the negative photoresist layers is rotatably deposited on the platen in a thickness which differs from that of at least one of the other negative photoresist layers. Preferably, the first and second microstructures are used to form different OVD types, the OVD types being selected from: (a) a diffraction grating; (b) a hologram; (c) a diffractive optical element (DOE); and (d) a network of micro-mirrors.
[0014] According to a third aspect, the present invention provides a method for producing a hybrid security device for a security document or token, the method comprising the steps of: depositing a negative photoresist layer on a sub-surface jacente; exposing the photoresist layer to an electron beam to write a stage of a first microstructure pattern and / or a second microstructure pattern; develop the negative photoresist layer to remove the unexposed areas; repeating the deposition, exposure and development steps to construct the first and second microstructures in successive stages, the first and second microstructures each having at least one stage; a first stage of the first microstructure being deposited, exposed and developed after a first stage of the second microstructure, and / or the final stage of the first microstructure being deposited, exposed and developed before a final stage of the second microstructure. Preferably, the first microstructure forms a first OVD and has a first height profile and the second microstructure forms a second OVD having a second height profile, the second height profile being at least 0.5 microns longer than the first profile. height. Preferably, the first OVD is a diffraction grating and the second OVD is a diffractive optical element (DOE). This aspect of the hybrid security device recognizes that the shorter of the two OVDs (ie the OVD having a considerably smaller height profile) can be formed at any height relative to the smaller OVD. For example, a diffraction grating will have a small height profile compared to, for example, a diffractive optical element (DOE), but this aspect of the invention allows the diffraction grating to be formed at a greater height than that of the DOE. Those skilled in the art will appreciate that this may be advantageous since a diffraction grating may be formed by a single stage that is approximately 0.5 microns tall. On the other hand, the DOE steps need to be formed more precisely to recreate the projected image correctly. Therefore, the heights of each stage forming the DOE will vary considerably, particularly towards the type of DOE microstructure. Here, the height of each individual floor can be relatively small. Therefore, it may be more efficient to form the diffraction grating in a single deposition, exposure and development process after completion of the DOE lithography. Preferably, the first and second microstructure patterns are respectively in first and second regions of the platen, the first and second regions being mutually interlaced or intersecting in at least one zone, such that the first and second regions are spaced apart. less than 5 mm on the plate, and preferably less than 1 mm.
[0015] Preferably, the first microstructure has a height above the underlying surface which is smaller than that of the second microstructure. Preferably, the first microstructure has a height above the underlying surface that is greater than that of the second microstructure. In another aspect, the present invention provides a method of producing a hybrid security device for a security document or token, the method comprising the steps of: providing a fused silica substrate (glass ); depositing a photoresist on the substrate; forming a mask according to a stage of a first and / or a second microstructure; exposing the photoresist to radiation through the mask; developing the photoresist to remove areas of the photoresist and exposing the substrate according to said stage of the first and / or second microstructures; reactive ion etching of said stage in the fused silica substrate; repetition of the deposition, masking, exposure, development and reactive ion etching steps for successively etching the first and second microstructures in the fused silica substrate; the first stage of the first microstructure being etched after the first stage of the second microstructure and / or the final stage of the first microstructure being etched before the final stage of the second microstructure. Preferably, the first microstructure is formed in fewer stages than the second microstructure. Preferably, the first microstructure has a height profile which differs from that of the second microstructure by more than 0.5 microns. Preferably, the first and second microstructures are formed respectively in first and second regions, the first and second regions being mutually interlaced or intersecting in at least one zone, such that the first and second regions are spaced apart by less than 5 mm and preferably less than 1 mm. Preferably, the fused silica substrate is used to form a raised surface pattern which is the inverse of the first and second microstructures; and the embossed surface pattern is used to emboss the first and second microstructures in an embossable layer to form the hybrid security device. Preferably, the relief surface pattern is formed on a metal plate produced by electrolytic deposition of the first and second microstructures etched into the fused silica substrate. This aspect of the invention recognizes that the original matrix for the hybrid security device may be formed by successive etchings of stages of the first and second microstructures in a glass substrate. This process requires the production of a mask for each of the different stages of the first and second microstructure patterns. Although this process takes time, the need for time efficiency is much less critical for the production of an original matrix. Those skilled in the art will understand that time and cost efficiency becomes much more relevant with the production of security features on valuable documents themselves. The invention relates to a commercially practical hybrid safety device having two sets of different microstructures having significantly different heights, in close proximity to one another, or even intertwined with each other. Normally, the original matrix for the production of these safety devices uses a positive photoresist because the resulting structure is generally more robust because the mass of the unexposed resist is a reinforcement helping to maintain the pattern in one piece. However, the present invention is based on the realization that microstructures having significantly different heights can be formed simultaneously on an original matrix in a relatively time-efficient process. The use of a negative photoresist exposed to electron beam writing avoids the necessity of using masking while the microstructures are precisely constructed layer by layer. Alternatively, the original matrix is formed by successive reactive ion etchings in a glass substrate that is used to make a metal plate. It will be understood that this is fundamentally different from deep etch shrinkage structure formation of material that is not part of the structure, thereby avoiding any problems with "proximity effects". The invention also relates to a security document incorporating a hybrid security device according to the invention.
[0016] BRIEF DESCRIPTION OF THE DRAWINGS Specific embodiments of the invention will now be described by way of example only with reference to the accompanying drawings, in which: FIG. 1 is a diagrammatic sectional view of the first stage of production of FIG. an original matrix for a hybrid security device; Figure 2 is a schematic sectional view of the first photoresist layer after exposure to the electron beam; Figure 3 is a schematic sectional view of the first stage of the first and second microstructures after the unexposed photoresist has been removed; FIG. 4 is a diagrammatic sectional view of the second negative photoresist layer covering the first stage of the first and second microstructures; Figure 5 is a schematic sectional view of the second negative photoresist layer after exposure to the electron beam; Figure 6 is a diagrammatic sectional view of the first stage of the first microstructure and the first and second stages of the second microstructure revealed after removal of the unexposed second photoresist layer; Figure 7 is a schematic sectional view of a third negative photoresist layer covering the first microstructure and the first and second stages of the second microstructure; Figure 8 is a diagrammatic sectional view of the third negative photoresist layer after exposure to the electron beam; Figure 9 is a schematic sectional view of the first microstructure and the first three stages of the second microstructure revealed after removal of unexposed photoresist; Figure 10 is a schematic sectional view of a fourth negative photoresist layer covering the first microstructure and the first three stages of the second microstructure; Figure 11 is a schematic sectional view showing the fourth photoresist layer after exposure to the electron beam; Figure 12 is a schematic sectional view of the first microstructure surrounding the second now complete microstructure to achieve the original finished matrix; Figure 13 is a schematic view of a bank note with a hybrid security device; Fig. 14A is an enlarged schematic view of a Medallion A shown in Fig. 13; Fig. 14B is another enlarged schematic view of Medallion A shown in Fig. 13; Figures 15 to 22 schematically illustrate the manufacture of an original matrix for a hybrid security device with diffraction gratings formed at the same height as a DOE; Figures 23 and 24 schematically illustrate the manufacture of an original matrix for a hybrid security device that have diffraction gratings at different levels; Figures 25 to 27 schematically illustrate the manufacture of an original matrix for a hybrid security device in which a diffraction grating is formed at a higher level than all other OVDs; and Figs. 28-36 schematically illustrate the manufacture of an original matrix for a hybrid security device in which the microstructure stages are successively etched in the surface of a fused silica (glass) substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT FIG. 1 shows the first production step of the original matrix which is used to create a metal plate which is used for embossing the security devices. A support plate 2 has a negative photoresist layer 4 deposited by rotation to a depth of 0.5 microns. Figure 2 shows the first negative photoresist layer 4 after an electron beam has written the first stages of the first and second micromotives (respectively, 6 and 8) in the first and second regions (7 and 9, respectively). Since the first and second microstructures (6 and 8) are formed in the same lithographic process, the first and second regions (7 and 9) can be positioned in close proximity, or even intertwined with each other. The spacing between the first and second "X" microstructures is less than 5 mm and typically less than 1 mm. The first and second regions intermingle in one or more areas on the platen. The regions may be interwoven such that strips of the first microstructure are interwoven with strips of the second microstructure. Similarly, the first and second regions may be mutually intertwined such that small parts or pixels of the first and second microstructures are dispersed into each other. In some cases, it may be necessary to have interlaced strip areas as well as interlocking pixels.
[0017] For a hybrid visual effect, the first and second regions must be finely interlaced or intersecting. This is achieved by maintaining the widths of the individual bands of the first and second microstructures to less than 1 mm. Similarly, the intersecting pixels of the first and second microstructures must have a maximum dimension of less than 1 mm. In this way, the zones of interlacing or mutual interlacing are perceived as generating a fused or hybrid visual effect rather than mere pieces or lines of two different visual effects. Figure 3 is a schematic sectional view through plate 2, after the first unexposed photoresist layer 4 has been removed by chemical etching. The first stage of the first and second microstructures (6 and 8) remains on the plate in the form of structures 0.5 microns high. In FIG. 4, a second negative photoresist layer 10 is deposited by rotation on the plate 2 to cover the first stages (6 and 8) of the first and second microstructures. In this illustrative example, the first microstructure 24 (see FIG. 12) happens to be a diffraction grating and is therefore complete after the formation of the gratings 6 of 0.5 microns in height. The second microstructure 22 (see FIG. 12) is in this case a DOE or a digital hologram and therefore has a much larger profile. Therefore, the electron beam writes (exposes) the second stage 12 of the second microstructure in the negative photoresist 10, as shown in FIG. 5. FIG. 6 shows the first and the last stages of the microstructures 6 and the first and second stages (8 and 12) of the second microstructure revealed once the second photoresist layer 10 has been etched.
[0018] Referring to FIG. 7, a third negative photoresist layer 14 is rotatably deposited on the plate 2, to a depth of 1.5 microns, so as to cover the arrays 6 of the first microstructure and the first and second stages (8 and 12) of the second microstructure. In FIG. 8, the third stage 16 of the second microstructure has been written in the third layer of photoresist 14. Then, in FIG. 9, the photoresist is etched to reveal the networks 6 of the first microstructure and the first three stages ( 8, 12 and 16) of the second microstructure. Figure 10 shows the fourth layer of photoresist 18 deposited by rotation on the plate 2 - this time to a depth of 2 microns. A 2 micron photoresist layer is relatively thick in photolithography but necessary in order to cover the first, second and third stages (8, 12 and 16) of the second microstructure. In FIG. 11, the electron beam writes the final stage 20 of the second microstructure into the fourth photoresist layer 18. The difference in height between the first and second microstructures is represented by Y, which in this case makes 1 , 5 microns. Once the photoresist 18 has been etched, the complete matrix 26 having the first and second microstructures (respectively 24 and 22) located in close proximity to one another, and / or mutually intermingled despite the fact that the first microstructure 24 has a height profile A much smaller than the height profile B of the second microstructure. If the same microstructures were to be etched from a positive photoresist, dispersion of the UV light at greater etch depths (i.e., greater than 1 μm) would produce proximity effects. As described above, proximity effects reduce the accuracy of the exposure step, so that the resulting microstructure is less accurate. Of course, the deposition thickness of the photoresist need not be 0.5 microns. It is usually varied to stick to the profile of micro- or nanostructures to form. For example, the heights of the last few stages in a hologram are usually small - possibly (for example) 0.2 microns. Naturally, the intensity of the electron beam is set to the required depth of exposure. With the completed original matrix 26, a metal plate may be formed by electroplating microstructures 22 and 24 on platen 2. Typically, nickel is used to form the required metal plate. The metal plate is a precise inverse of the first and second microstructures (respectively 24 and 22) formed as a relief surface pattern. This embossed surface pattern is used to emboss the security features in the individual security documents. The security device usually has a UV curable epoxy ink layer, which is embossed by the metal plate before being cured. After curing, the microstructures are fixed and the safety device is often enclosed under a transparent protective layer.
[0019] As shown in FIG. 13, a bank note 28 has a security device 30 formed in accordance with the present invention. The first microstructure 24 is a diffraction grating occupying a circular zone. The second microstructure 22 is a DOE or a micro-mirror array and occupies a second region of the hybrid security device 30. However, in the dollar sign area 32, the first and second regions respectively having the first and second microstructures. are intertwined or intertwined. FIG. 14A is a schematic enlargement of a medallion A shown in FIG. 13. Here, the first and second regions of the first and second microstructures (respectively 24 and 22) are in the form of interlaced strips 34. As described herein above, the width W of these strips 34 is less than 1 mm, so that the eye perceives a hybrid visual effect generated by the first and second microstructures (24 and 22). Wider bands would be seen as alternating lines of the visual effect of the first microstructures 24 and the visual effect of the second microstructures 22.
[0020] Fig. 14B shows another form of the interleaving or interlacing zone 32. In this form, the first and second microstructures (24 and 22) are in first and second regions in the form of small pieces or pixels 36. Again, the pixels 36 have a maximum dimension W of 1 mm so that the hybrid visual effect is generated instead of a "chessboard" of the visual effect of the first microstructure 24 and the visual effect of the second microstructure 22. It will be understood that the hybrid security device 30 may have several interleaving or intercrossing zones 32 and that the first and second regions in these zones may be in the form of bands and pixels or other forms. In addition, the hybrid security device 30 may have more than two different types of microstructures and may generate a hybrid effect from three or more different OVD types. Hybrid visual printing created by two or more different OVDs is highly distinctive and exceptionally difficult to replicate by the counterfeiter. Figures 15 to 22 are schematic illustrations of the lithographic fabrication of an original matrix for a hybrid security device having a diffraction grating formed at the same height as the top of a diffractive optical element; the process starts with a support plate 2 having a negative photoresist layer rotatably deposited on the upper surface to a depth of 0.5 microns, as shown in Fig. 15. Fig. 16 shows the first negative photoresist layer before and after an electron beam has written the first stage 8 of the second microstructure in a second region 9. Unlike the process shown in Figures 1 to 12, the photoresist 6 in the first region 7 is not the first stage of the first microstructure, but rather just a support layer which will be below the first microstructure in the completed original matrix (see Figure 22). In FIG. 17, a second photoresist layer is deposited on the support layer 6 of the first microstructure and the first stage 8 of the second microstructure. The electron beam exposes the photoresist to write the second stage 14 of the second microstructure and exposes the second support layer 12 of the first microstructure (see Fig. 18). FIG. 19 shows the third photoresist layer covering the second support layer 12 of the first microstructure and the second stage 14 of the second microstructure. Figure 20 shows the third support layer 18 of the first microstructure and the third stage 20 of the second microstructure after exposure to the write and develop electron beam to remove unexposed photoresist. Then, as shown in Fig. 21, the third support layer 18 of the first microstructure, and the third stage 20 of the second microstructure is covered with photoresist 22. The photoresist 22 is exposed to the write electron beam. As shown in FIG. 22, the write electron beam exposes the first stage and final stage 24 of the first microstructure 25 as well as the fourth stage and the final stage 26 of the second microstructure 27. The height profile A of FIG. the first microstructure 25 is much lower than the height profile B of the second microstructure 27, but the underlying support layers 6, 12 and 18 allow the height H1 of the first microstructure 25 to be identical to the height H2 of the second microstructure 27. Figures 23 to 27 schematically illustrate the steps of manufacturing an original matrix to produce a hybrid security element with two diffraction gratings formed at different levels with respect to the diffractive optical element. Figures 23 and 24 schematically illustrate the situation in which the first microstructure 25 is formed at any arbitrary level of the support plate 2. In this case, the diffraction gratings 24 of the first microstructure 25 are supported on only two underlying layers 6 12. The construction process of the other microstructures 27 and 31 may continue in accordance with the process steps described above. As depicted in FIGS. 25, 26 and 27, a third microstructure 31 having diffraction gratings 24 may be formed at a height of H1 above the height H2 of the first and second microstructures (respectively 25 and 27). The first stage and final stage 24 of the third microstructure 31 appears after the final stage 26 of the second microstructure 27 by the simple fact of providing as many underlying support layers (6, 12, 18, and 4) as necessary. to get the required height. Figures 28 to 36 schematically illustrate the steps of manufacturing an original matrix of a hybrid security element with two or more OVDs having height profiles. This process relies on a series of reactive ion etchings (GIRs) in a fused silica (glass) substrate 2. This process requires a series of photomasks 44 formed from a suitable material such as chromium. It will be understood by those skilled in the art that the masks are produced by rotational deposition of a layer of photoresist on a chromium layer. The photoresist is exposed to radiation such as a writing electron beam and then developed for the removal of areas from the photoresist and exposing the surface of the chromium photomask 44 in the pattern of the first and second microstructures. A suitable etching agent is used to form openings 48 through the chromium layer to complete the chrome photomask 44.
[0021] As shown in Fig. 28, the glass substrate 2 is coated with a photoresist layer 4 which is exposed to UV radiation 46 through the photomask 44. The photoresist 4 is exposed through apertures 48. exposed photoresist are removed by a suitable etching agent to create voids 50 (as shown in Fig. 29).
[0022] According to Fig. 30, the glass substrate 2 is subjected to reactive ion etching (GIR) 52 using appropriate ions such as accelerated argon ions through a suitable gaseous environment. The exposed areas 54 below the voids 50 in the photoresist 4 are etched to a tightly controlled depth.
[0023] As shown in FIG. 31, the remaining photoresist areas 4 are etched with an oxygen plasma leaving raised structures 56 between the etched recesses 54. Next, as shown in FIG. is repeated for subsequent reactive ion etching in the glass substrate 2. The second photoresist layer 58 is rotatably deposited on the glass substrate to a depth overlying the elevated characteristics 56. According to Fig. 33, the second chromium photomask 60 is placed on photoresist 58 and exposed to UV radiation 46. Areas exposed to UV light through apertures 48 formed in mask 60 are removed to create voids 62 in second photoresist layer 58, as shown in FIG. FIG. 34. As shown in FIG. 35, a second reactive ion etching 52 further deepens the recesses 54 while creating new ones. to the recesses for deeper characteristics 54 in the glass substrate 2. As shown in Fig. 36, the remaining areas of the second photoresist layer 58 are etched by an oxygen plasma (also called "polishing"). As with the first and second reactive ion etches 52, the associated recesses 54 and 64 form, in association with the raised areas 68, the first and second microstructures 22 and 24 required on the original matrix 66. Of course, in reality, much more that two steps of GIR will be used to create the matrix 66 and the first and second complex microstructures (24 and 22) thereon.
[0024] As illustrated in Figures 28-36, each GIR is a binary process and therefore, after only two etches, the glass substrate 2 supports four-level microstructures. Therefore, if the process is repeated n times using n different masks, the microstructures will have 2n different levels.
[0025] The GIR method above is well suited for the fabrication of structures such as DOEs that are subjected to "refractive index matching". Refractive index matching refers to the modification of a diffractive microstructure (usually by increasing the height profile) to account for the actual change in the refractive index of the microstructure material when covered by a refractive index. protective coating. The diffractive microstructure material typically has a refractive index of about 1.5. When coated, its index can be shifted by about 0.3, causing a positional shift of constructive and destructive interference, and large errors result. As a result, the original microstructure is formed (height and stage heights are increased) to accommodate the offset. In the light of the foregoing, diffractive structures subjected to refractive index matching are about 2.5 microns deep and are typically eight-level structures. Using electron beam lithography, each individual exposure step can form a structure about 1 micron high. The construction of structures that are about 2.5 microns high using electron beam lithography is therefore not as time and cost effective as the GIR method above. Traditionally, if a security element for a document of value had to include a DOE alongside a DOVD (Optically Variable Diffractive Device), the DOE would be manufactured by GIR and DOVD by a normal electron beam lithography process. These two constitutive devices would then undergo a process of recombination, producing between them a wide spacing, likely to often reach about 2 centimeters.
[0026] The techniques developed by the present invention allow the incorporation of the diffractive grating into any selected level of the negative photoresist (if using the electron beam lithography technique), or a level of the GIR process to eliminate the spacing and allow the interlacing or crisscrossing of the two different devices.
[0027] As used herein the terms including / understanding and their grammatical variations are to be understood as specifying the presence of features, entities, steps, components or groups thereof, as described, but do not exclude the presence or the adding one or more other characteristics, entities, steps, components or groups thereof.
[0028] The invention has been described here by way of example only. Those skilled in the art will readily understand that many variations and modifications can be made without departing from the spirit and context of the inventive concept taken in its broad sense.

权利要求:
Claims (20)
[0001]
REVENDICATIONS1. Hybrid security device for security documents and tokens, characterized in that it comprises: a substrate (2); a first microstructure (22) for a first optically variable device (OVD) supported on the substrate in a first region (7); and a second microstructure (24) for a second OVD supported on the substrate in a second region (9); the first and second regions (7, 9) being mutually intertwined or intersecting in at least one area; and the first microstructure (22) having a height profile that differs from that of the second microstructure (24) by more than 0.5 microns.
[0002]
Hybrid security device according to claim 1, characterized in that the first microstructures (22) have a maximum height above the surface of the substrate (2) which differs from a maximum height of the second microstructures (24) of more than 0.5 microns.
[0003]
Hybrid security device according to claim 1, characterized in that the first and second regions (7, 9) are separated by less than 5 mm.
[0004]
Hybrid security device according to claim 1, characterized in that the first and second regions (7, 9) in the interleaving or intercrossing zone are in the form of intersecting pixels of the first and second microstructures. microstructure, and each of the pixels has a maximum dimension of 1 mm in all directions.
[0005]
Hybrid security device according to claim 1, characterized in that the first and second regions (7, 9) in the interleaving or intercrossing zone are in the form of interlaced strips of the first and second microstructures. microstructure, each band having a maximum width of 1 mm.
[0006]
Hybrid security device according to one of Claims 1 to 5, characterized in that the first OV microstructure (22) is a diffraction grating or a hologram and the second OV microstructure (24) is a diffractive optical element ( DOE).
[0007]
7. Hybrid security device according to any one of claims 1 to 5, characterized in that the first microstructure OV (22) is a network of micro-mirrors and the second microstructure (24) is a DOE.
[0008]
8. Hybrid security device according to any one of claims 1 to 5, characterized in that the first microstructure OV (22) is a network of micro-mirrors and the second microstructure (24) is a diffraction grating.
[0009]
Hybrid security device according to any one of claims 1 to 7, characterized in that the first and second OV microstructures (22, 24) are formed from an embossable, radiation curable epoxy ink.
[0010]
10. Hybrid security device according to any one of claims 1 to 8, characterized in that the mutual interlacing zone consists of an area of the first microstructure OV only.
[0011]
A method of producing a hybrid security device for a security document or token, the method being characterized in that it comprises the steps of: spin depositing a negative photoresist layer (4) on an underlying surface; exposing the negative photoresist layer to an electron beam to write a first stage of a first microstructure pattern (6) and a second microstructure pattern (8); developing the negative photoresist layer (4) to remove the unexposed areas of the negative photoresist such that there remains a first at least partial microstructure and a second partial microstructure; spin depositing a next negative photoresist layer (10) on the platen to cover the at least partial first microstructure and the second partial microstructure; exposing the next photoresist layer (10) to an electron beam to continue writing the first microstructure pattern if it has not been completed in a previous exposure, and continue to write the second microstructure pattern; developing the next photoresist layer (10) such that there remains the first microstructure and the second partial microstructure; spin depositing a final negative photoresist layer (16) on the platen to cover the first microstructure and the second partial microstructure, exposing the final negative photoresist layer (16) to an electron beam to complete the writing of the second pattern microstructure; developing the final negative photoresist layer (16) such that there remains the first microstructure and the second microstructure on the platen; using the platen and the first and second microstructures to form a raised surface pattern with an inverse of the first and second microstructures; and using the embossed surface pattern to emboss the first and second microstructures (22, 24) in an embossable layer to form the hybrid security device.
[0012]
12. The method of claim 11, characterized in that the relief surface pattern is formed on a metal plate.
[0013]
13. The method of claim 12, characterized in that the metal plate is formed by electrolytic deposition of the first and second microstructures (22, 24) on the plate (2).
[0014]
14. Method according to any one of claims 11 to 13, characterized in that the second microstructures (24) are at least 0.5 pm more than the first microstructures (22).
[0015]
15. Method according to any one of claims 11 to 14, characterized in that at least one of the negative photoresist layers is deposited by rotation on the plate in a thickness which differs from that of at least one other of layers of negative photoresist.
[0016]
The method according to any one of claims 11 to 15, characterized in that the first and second microstructures (22, 24) are used to form different types of optically variable devices (OVDs), the types of optically variable devices being selected from: (a) a diffraction grating; (b) a hologram; (c) a diffractive optical element (DOE); and (d) a network of micro-mirrors.
[0017]
A method of producing a hybrid security device for a security document or token, the method being characterized in that it comprises the steps of: depositing a negative photoresist layer (4) on a sub-surface jacente; exposing the photoresist layer (4) to an electron beam to write a stage of a first microstructure pattern (6) and / or a second microstructure pattern (8); developing the negative photoresist layer (4) to remove the unexposed areas; repeating the deposition, exposure and development steps to construct the first and second microstructures (22, 24) in successive stages, the first and second microstructures each having at least one stage; a first stage of the first microstructure (22) being deposited, exposed and developed after a first stage of the second microstructure (24), and / or the final stage of the first microstructure (22) being deposited, exposed and developed before a final stage of the second microstructure (24).
[0018]
18. The method of claim 17, characterized in that the first microstructure (22) forms a first OVD and has a first height profile and the second microstructure (24) forms a second OVD having a second height profile, the second profile height at least 0.5 microns more than the first height profile.
[0019]
19. The method of claim 18, characterized in that the first OVD is a diffraction grating and the second OVD is a diffractive optical element (DOE).
[0020]
20. Security document incorporating a hybrid security device according to any one of claims 1 to 9.

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DE112015001892T5|2017-02-02|

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引用文献:

公开号 | 申请日 | 公开日 | 申请人 | 专利标题

US4113895A|1976-11-19|1978-09-12|American Can Company|Method for producing multilayered coated substrate|

GB9211123D0|1992-05-26|1992-07-08|Amblehurst Ltd|Holographic device|

GB9810399D0|1998-05-14|1998-07-15|Rue De Int Ltd|Holographic security device|

GB0016356D0|2000-07-03|2000-08-23|Optaglio Ltd|Optical structure|

US8025952B2|2002-09-13|2011-09-27|Jds Uniphase Corporation|Printed magnetic ink overt security image|

GB0400681D0|2004-01-13|2004-02-18|Rue De Int Ltd|Security device|

GB0401370D0|2004-01-21|2004-02-25|Rue De Int Ltd|Security device|

EP1744904B2|2004-04-30|2019-11-06|Giesecke+Devrient Currency Technology GmbH|Sheeting and methods for the production thereof|

DE102004039355A1|2004-08-12|2006-02-23|Giesecke & Devrient Gmbh|Security element and method for its production|

US7354845B2|2004-08-24|2008-04-08|Otb Group B.V.|In-line process for making thin film electronic devices|

DE102004049118A1|2004-10-07|2006-04-13|Giesecke & Devrient Gmbh|Security element and method for its production|

GB0601093D0|2006-01-19|2006-03-01|Rue De Int Ltd|Optically Variable Security Device|

DE102006016139A1|2006-04-06|2007-10-18|Ovd Kinegram Ag|Multi-layer body with volume hologram|

EP1855127A1|2006-05-12|2007-11-14|Rolic AG|Optically effective surface relief microstructures and method of making them|

MX2009002818A|2006-09-15|2009-05-15|Securency Int Pty Ltd|Radiation curable embossed ink security devices for security documents.|

JP4876853B2|2006-10-24|2012-02-15|凸版印刷株式会社|OVD medium and printed information including OVD medium|

GB0711434D0|2007-06-13|2007-07-25|Rue De Int Ltd|Holographic security device|

DE102007061827A1|2007-12-20|2009-06-25|Giesecke & Devrient Gmbh|Security element and method for its production|

DE112010003249T5|2009-08-10|2013-05-02|Securency International Pty Ltd|Optically variable devices and methods of manufacture|JP6834344B2|2016-05-06|2021-02-24|凸版印刷株式会社|Display|

DE102016115428A1|2016-08-19|2018-02-22|Schreiner Group Gmbh & Co. Kg|Document for the confidential transmission of confidential information|

US10296800B2|2017-04-26|2019-05-21|Ncr Corporation|Media validation processing|

BG67098B1|2017-05-03|2020-06-30|„Демакс Холограми“ Ад|Optical variable element|

AU2018100183B4|2018-02-09|2018-08-16|Ccl Secure Pty Ltd|Methods for multi-channel image interlacing|

WO2019164542A1|2018-02-21|2019-08-29|Universtiy Of Utah Research Foundation|Diffractive optic for holographic projection|

DE102018104932A1|2018-03-05|2019-09-05|Osram Opto Semiconductors Gmbh|Method for producing a multilayer optical element|

EP3762778A4|2018-03-06|2022-03-09|Applied Materials Inc|Method of building a 3d functional optical material stacking structure|

GB2572550B|2018-03-28|2020-07-22|De La Rue Int Ltd|Optical device and method of manufacture thereof|

GB2572813A|2018-04-12|2019-10-16|Iq Structures Sro|Volume optical elements|

CN110161606B|2019-05-24|2021-04-27|中国科学院微电子研究所|Preparation method of coupling grating|

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优先权:

申请号 | 申请日 | 专利标题

AU2014901816A|AU2014901816A0|2014-05-16|Hybrid security device for security document or token|

AU2014100511A|AU2014100511B4|2014-05-16|2014-05-16|Hybrid security device for security document or token|

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